Ansys 2021 R2 accelerates exploration, collaboration and engineering automation

PITTSBURGH, July 20, 2021 / PRNewswire / –

/ Highlights

  • With the new Ansys 2021 R2, engineers can capitalize on ever-increasing computing power to optimize complex products, assemblies and systems across industries.
  • Ansys 2021 R2 empowers engineers to bring better products to market faster through systems engineering workflows that bring together multiple engineering tools and disciplines to help stakeholders understand the interactions and synergies of sub- systems.
  • The latest version increases visibility and reuse of data for materials, digital twin components, electronic components, and compliance initiatives.

Improvements to Ansys 2021 R2 Products provide the power to explore early-stage product design and complex systems engineering, from the nanoscale of chip design to the mission level of aerospace and defense operational environments . AnsysIndustry-leading simulation solutions (NASDAQ: ANSS) offer an open approach that streamlines engineering through simplified workflows, integrated data management, and easy access to high-performance computing (HPC) power through the cloud.

Technical exploration through simulation is virtually risk-free because engineers are no longer tied to an expensive and long prototype-test-redesign cycle. New design ideas can be evaluated virtually in hours, not weeks, freeing up time to optimize the best design candidates or develop ideas that redefine markets. With access to nearly unlimited computing through Ansys Cloud, engineers using Ansys 2021 R2 products have the speed and flexibility to ask the “what if” questions that lead to innovations in autonomous vehicles, chip design, critical and more sustainable connectivity solutions. travel via lightweight materials and electrification.

Speed ​​improvements are built into the latest Ansys products.

  • Productivity improvements allow engineers to perform optical simulation meshing up to 20 times faster and local meshing up to 100 times faster.
  • Ansys Mechanical 2021 R2 streamlines cyclic modal and structural analyzes using a new multi-stage cyclic symmetry capability that can ultimately reduce run times up to 50 times compared to full 360-degree resolution.
  • In semiconductors, 2021 R2 provides advanced power analysis (APA) ready at 3nm and improves the efficiency of voltage drop correction by 3 times, using aggressor identification, assay simulation tools and links to Engineering Change Order (ECO) tools.
  • Using the cloud for semiconductor simulation delivers at least 4x the cost and efficiency per base hour with Ansys 2021 R2.
  • In fluids, Ansys 2021 R2 allows up to 5X speed increase for high speed flows up to Mach 30 and above, with improved processing of reaction sources in the density-based solver.
  • The streamlined, low-order workflows throughout Ansys 2021 R2 provide rapid responses to design and product development issues, allowing engineers to focus computing power on the best design candidates.
  • The new Phi Plus mesh generator addresses the challenges of 3D integrated circuit package by speeding up the initial mesh for lead wire package electromagnetism and signal integrity analysis by an average of 6-10 times.

“Thanks to Ansys HFSS’s speed and ability to solve multiple simulation problems in different areas, we were able to analyze performance and make design changes faster and with better data,” said Doug Stetson, CEO of FreeFall Aerospace. “We were able to build complete models in HFSS, which allows us to go straight to the prototyping stage with confidence. Meeting our customers’ requirements with precision and speed is our priority and Ansys HFSS makes it possible.

In addition to directly accelerating simulation, Ansys 2021 R2 enables engineers to work more efficiently through an open platform that integrates multiple sets of tools. For example, Ansys Mechanical users can embed Python programming language scripts directly into their models to automate the flow using industry standard open source coding.

Automation and collaboration are recurring themes in Ansys 2021 R2, as updates allow teams to work effectively in an ecosystem that connects design, simulation, systems integration and manufacturing. Many of the new release products incorporate automated one-click integrations that allow users to take advantage of additional technologies to broaden their simulation scope. Product and process integration also enables smooth transfer of data between applications, increasing usability and productivity. For example, Ansys 2021 R2 provides new and improved workflows for Chip System (CPS) and Printed Circuit Boards (PCB) with Automation for IC-on-Package and Multi-Zone PCBs with Rigid Flexible Cables , which are popular in modern electronic devices. .

“Ansys is a recognized leader in the simulation of mechanical, electromechanical, thermal and radio frequency transmission to predict unwanted multiphysics interactions – noise, vibrations, physical interference, electromagnetic interference and material fatigue – all of the main causes of product failure,” said said Craig Brown, executive consultant at CIMdata. “Ansys provides essential expertise to scale the cyber-physical products of tomorrow, understanding silicon engineering workflows as well as system engineering workflows and everything in between to create an electronic systems product. innovative and profitable. “

The visibility and reuse of data through dashboards and dedicated libraries further increase the efficiency of engineers using Ansys 2021 R2. Common component libraries of digital twins, electronic components and materials allow engineers to quickly access reliable data. For example, materials management updates allow customers using restricted substances to access the latest Supplier Data Sheets (SDSs), ensuring that products comply with global regulations.

Compliance, certifications and standards are addressed in many updated products. Ansys 2021 R2 is now a one-stop-shop for certification of embedded software across all industries, including the highest security integrity / assurance levels of DO-178C, ISO 26262, IEC 61508 and EN 50128.

“Simulation isn’t just about solving advanced multiphysics design problems for us,” said Shane Emswiler, Senior Vice President of Products. “This includes taking into account all of the workflow and product function required to enable our customers to be successful. From automotive and industrial to aerospace and advanced electronics, Ansys is the leading provider of critical integrated solutions that help customers build their products and systems to be successful. “

To learn more about Ansys 2021 R2, please visit:

For specific updates on each of Ansys’ product suites, please visit:

/ About Ansys

If you’ve ever seen a rocket launch, flown on an airplane, drive a car, use a computer, touch a mobile device, cross a bridge, or put on wearable technology, chances are you’ve used a product where Ansys software played an essential role in its creation. Ansys is the world leader in engineering simulation. Through our ubiquitous engineering simulation strategy, we help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by the imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, Visit to the United States for more information.

Ansys and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its affiliates in United States or other countries. All other brand names, products, services and features or trademarks are the property of their respective owners.



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